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Issuance No. 1 July 2009
Contents:
China's TDIA, YRP and XGP Forum Signing Memorandum to Exchange TDD Technical Information
WILLCOM to Bring XGP to ITU World in October
XGP Forum Celebrating Establishment
Introduction of XGP Forum
Wireless Technology Park 2009
WILLCOM Towards the Start of Thorough XGP Service
Postscript
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